Quasys is a distributor for OEM companies from the USA, Asia and Europe.

Production systems

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Click on the name in the list on the left below for more product information and also links to the manufacturer.

Tresky Automation DIE Bonder

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DIE bonder

Tresky Automation

In the world of semiconductor manufacturing, precision is of paramount importance. Therefore, from the very beginning, Tresky has paid special attention to developing a highly precise machine basis that can meet both, current and future manufacturing requirements. These requirements hold true, no matter where our international customers manufacture around the world. This is why granite plays a very special role for us. Additionally, due to the high modularity of Tresky’s DIE bonders, the machines are designed for high flexibility.

www.tresky.com

Versatility and Accuracy

T-6000-L

Flexibility

TRESKY’s entry-level model, the DIE bonder T-6000-L, is a fully automatic placement system for universal and specific use in prototyping as well as series production.

The T-6000-L offers an unprecedented level of flexibility through a high degree of modularity. Fast switching between different bonding techniques is possible at any time and the manual mode enables fast bonding results without programming.

Technical Data

Travel Range with Wafer: 400 mm × 410 mm
Wafer Size: 2” – 8” (Ring & Frame)
Travel Range w/o Wafer: 540 mm × 410 mm
Z-Movement: 100 mm
Chip Rotation Max.: up to 360°
Bond Force Range: 0.01 N – up to 100 N *
Axis Speed: up to 1.8 m/sec
Placement Accuracy: 8 μm @ 3 sigma
Axis Resolution: XYZ: 0.01 μm, Theta: 0.-01°
Min./Max. Component Size: 80 μm – 100 mm **

* Higher bond forces on request
** Other dimensions on request | Note: All specifications are subject to change without prior notice

Precision for Complex Bonding

T-7000

Granite-Based Precision

The T-7000 machine platform has been developed for use in nanoelectronics and optoelectronics due to its precision. As is standard at Tresky, the bonder platform is based on granite, so that the highest possible precision can be guaranteed for optical components such as VCSELs, lasers, photodiodes, IR sensors or for the development of quantum technologies.

Technical Data

Working Area with Wafer Table: 500 mm × 700 mm
Possible Wafer Sizes: up to 8” (Ring & Frame)
Travelling Range Z-axis: 100 mm
Tool Rotation Max.: up to 360°
Bond Force Range: 0.01 N – up to 300 N *
Axis Speed: up to 2.0 m/sec
Positioning Accuracy: < 1.0 μm @ 3 sigma
Axis Resolution: XYZ: 0.001 μm, Theta: 0.005°
Min/Max. Chip Size: smaller than 0.05 mm
Acceleration: up to 2.5 G

* Higher bond forces on request

Versatility and Accuracy

T-8000-G

The Art of Engineering

The T-8000-G DIE bonder is the result of continuous engineering development and offers a larger working area in which 12-inch wafers can be processed. The bonding system combines precision with versatility and speed based on a generously sized granite gantry that allows for maximum accuracy. Thus, the T-8000-G is designed for current and future challenges.

Technical Data