Quasys is a distributor for OEM companies from the USA, Asia and Europe.
Production systems
Through close collaboration with our partners we can serve you as well as a customer as a direct contact, sometimes even better. Do you know our partners already?
Click on the name in the list on the left below for more product information and also links to the manufacturer.
Tresky Automation DIE Bonder
Hesse Wire Bonder
xyztec Bond Tester
Nordson March Plasma
Budatec Vakuumlöten
Norcom Systems Inc.
Plasmasysteme
Nordson March Plasma
MARCH Plasma is a leading provider of high performance plasma systems and one of the pioneers of this relatively new technology. Primary applications are treatment of PC boards, substrates, carriers, wafers and many other products which require surface activation and/or removal of organic material.
In many Microelectronic applications bond force of Die Bonds and Wire Bonds have been significantly improved and are standard for critical automotive electronics. Underfill of Flip Chips improves wicking speed and surface wetting. In many applications yield can be improved significantly with Plasma treatment. However, this is only possible if Gas and Gas composition, Power and Process time are fine tuned and optimized for each different application.
Read more on the manufacturer's website or contact us for more information.
Documents
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Desktop model for small lot sizes
AP-600
Direct or downstream plasma, 600W at 13.56 MHz.
Model for medium batch sizes
AP-1000
Direct or downstream plasma, large chamber of 457x457x610mm, for up to 12 magazines.
As a batch system for medium batch sizes
Flextrak Pre-Bond
Or – with handler – for in-line applications and high throughput.
For descum process
Flextrak Wafersystem
For flip chip applications on wafer.
Contact Person
Rolf Nussbaumer
- Management
- Feeder Team
- Sales
Direct: +41 41 541 14 70