Tray Feeding Solutions
Test Socket / Tools
Through close collaboration with our partners we can serve you as well as a customer as a direct contact, sometimes even better. Do you know our partners already?
Click on the name in the list on the left below for more product information and also links to the manufacturer.
MARCH Plasma is a leading provider of high performance plasma systems and one of the pioneers of this relatively new technology. Primary applications are treatment of PC boards, substrates, carriers, wafers and many other products which require surface activation and/or removal of organic material.
In many Microelectronic applications bond force of Die Bonds and Wire Bonds have been significantly improved and are standard for critical automotive electronics. Underfill of Flip Chips improves wicking speed and surface wetting. In many applications yield can be improved significantly with Plasma treatment. However, this is only possible if Gas and Gas composition, Power and Process time are fine tuned and optimized for each different application.
Direct or downstream plasma, 600W at 13.56 MHz.
Direct or downstream plasma, large chamber of 457x457x610mm, for up to 12 magazines.
Or – with handler – for in-line applications and high throughput.
For flip chip applications on wafer.
CH-6331 Hünenberg / Switzerland
Phone +41 41 / 740 20 60
Telefax +41 41 / 741 62 13
D-79356 Eichstetten / Germany
Phone +49 7663 / 6086-0
Telefax +49 7663 / 6086-11