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MARCH Plasma is a leading provider of high performance plasma systems and one of the pioneers of this relatively new technology. Primary applications are treatment of PC boards, substrates, carriers, wafers and many other products which require surface activation and/or removal of organic material.
In many Microelectronic applications bond force of Die Bonds and Wire Bonds have been significantly improved and are standard for critical automotive electronics. Underfill of Flip Chips improves wicking speed and surface wetting. In many applications yield can be improved significantly with Plasma treatment. However, this is only possible if Gas and Gas composition, Power and Process time are fine tuned and optimized for each different application.
Direct or downstream plasma, 300W or 500W at 13.56 MHz.
Direct or downstream plasma, large chamber of 457x457x610mm, for up to 12 magazines.
For batch processing plasma.
Or – with handler – for in-line applications and high throughput.
For flip chip applications on wafer.
CH-6331 Hünenberg / Switzerland
Phone +41 41 / 740 20 60
Telefax +41 41 / 741 62 13
D-79356 Eichstetten / Germany
Phone +49 7663 / 6086-0
Telefax +49 7663 / 6086-11