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Quasys represents Hesse Mechatronics with its ultrasonic wire bonders for all wire sizes.
Hesse GmbH develops and manufactures ultrasonic wire bonders for all wire dimensions as well as ultrasonic flipchip bonders in combination with standardized or customized automation solutions. For more information see the products below, go to http://www.hesse-mechatronics.com or contact us.
The Bondjet BJ855 is the latest generation of fully automated fine wire bonders and expands the existing product portfolio of fine wire bonders. The Bondjet BJ855 is characterized by the following features:
The Bondjet BJ855 meets the increasing demands of bonding and contributes to easy porting through smart functions such as the bondhead memory or the chip libraries. Typical applications are components in RF technology, COB, MCM, hybrids, optical and automotive electronics. In addition to a standard configuration, Hesse offers automation concepts individually adapted for every application. The Bondjet BJ855 defines the latest state of technological development compared to the competition and is benchmarked for:
The Bondjet BJ653, with its changeable bond heads, serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire and ribbon. The operating methods from manual to automatic bonding is particularly appropriate for the use in laboratories, in the development and for suppliers for validating their product quality. BJ653 is ideal for product samples, pre-production prototypes or small volume production runs in proven and reliable Hesse quality. The Bondjet BJ653 is part of the new bonder generation and offers the same handling regarding operation and look & feel as the the fully automatic machines of Hesse. It is characterized by an open workspace, which achieves the same process result as in a fully automated production wire bonder. The Bondjet BJ653 has a lower throughput than the other Bondjets but is the avenue to fully automatic wire bonding. The available bondheads for the BJ653 are identical to the bondheads for the Hesse production machines. This enables a targeted preparation of the production process on the Bondjet BJ653.
Bondjets BJ955 and BJ959 of the new bonder generation are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.
Bondjet BJ955/959 are characterized by several new features:
Outstanding features are high speed and the largest bonding area. A change from aluminium to copper can be realized within minutes. The Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non-destructive pulltest and a unique transducer integrated sensor for 100% quality monitoring in real-time. Advanced features available on the Bondjet BJ955 and BJ959 are designed to meet your present and future requirements and greatly enhance productivity.
The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application. The portfolio of automation components for our machines consists of the following groups:
CH-6331 Hünenberg / Switzerland
Phone +41 41 / 740 20 60
Telefax +41 41 / 741 62 13
D-79356 Eichstetten / Germany
Phone +49 7663 / 6086-0
Telefax +49 7663 / 6086-11