Plastronics is a leading global provider of technology and innovation for semiconductor reliability testing, meeting the industry's burn-in socket needs for more than 40 years. It all started when the team invented the first open-top socket for production burn-in of LCC and PLCC packages to help semiconductor manufacturers significantly increase their throughput and decrease costs.

Now, Plastronics offers complete, reliable burn-in test socket solutions for all the latest packaged devices. Plastronics has the most comprehensive QFN catalog in the world, as well as finished sockets to fulfill burn-in, humidity, failure analysis and test requirements for Leaded, LGA and BGA devices.

Contact us today to learn more, or click on photographs below for more information.

BGA Sockets (Pitch: 0.50, 0.65, 0.75, 0.80, 1.00, 1.27, 1.50)
BCC / CSP / LPCC / MLF / MLP / QFN / VQFN / HVQFN Sockets (Pitch:0.40, 0.50, 0.65, 0.80 and 1.00 mm)
Land Grid Array (LGA) Sockets (Pitch: 1.00 and 1.27 mm)
Leadless Chip Carrier (LCC) Sockets These Sockets are made for “Dead-Bug”. Please contact us regarding a 'Live-Bug" version.
PLCC Sockets (1.27 mm Pitch)
Side Contacting (SO) Sockets (1.27 mm Pitch Sockets)
Lead Tip Contacting (SSOP Sockets) (Pitch: 0.64, 0.65, 0.80 and 1.02 mm)
Small Outline J-Lead (SOJ) Sockets (1.27 mm Pitch Sockets)

Trade Fairs


May 7 - 9, 2019

Productronica Munich

November 12-15, 2019