Plasma systems


MARCH Plasma is a leading provider of high performance plasma systems and one of the pioneers of this relatively new technology. Primary applications are  treatment of PC boards, substrates, carriers, wafers and many other products which require surface activation and/or removal of organic material.

In many Microelectronic applications bond force of Die Bonds and Wire Bonds have been significantly improved and are standard for critical automotive electronics. Underfill of Flip Chips improves wicking speed and surface wetting. In many applications yield can be improved significantly with Plasma treatment. However, this is only possible if Gas and Gas composition, Power and Process time are fine tuned and optimized for each different  application.


Read more on the manufacturer's website or contact us for more information.



AP-600 desktop model for small lot sizes, direct or downstream plasma, 300W or 500W at 13.56 MHz.
AP-1000 model for medium batch sizes, direct or downstream plasma, large chamber of 457x457x610mm, for up to 12 magazines.
AP-1500 plasma system with a large chamber for batch processing plasma.
FlexTRAK Pre-Bond as a batch system for medium batch sizes or - with handler - for in-line applications and high throughput.
FlexTRAK wafer system for descum process for flip chip applications on wafer.

Trade Fairs

IPC / APEX Las Vegas, Nevada

January 29 - 31, 2019
booth 2336


May 7 - 9, 2019

Productronica Munich

November 12-15, 2019