Hesse Fine Wire- and Heavy Wire Bonder

Quasys represents Hesse Mechatronics with its ultrasonic wire bonders for all wire sizes.

Hesse GmbH develops and manufactures ultrasonic wire bonders for all wire dimensions as well as ultrasonic flipchip bonders in combination with standardized or customized automation solutions.

For more information see the products below, go to http://www.hesse-mechatronics.com or  contact us

 

 

 

Fine Wire Bonder Bondjet BJ855 - High Speed Fully Automatic Fine Wire Bonder (Wedge-Wedge and Ball-Wedge)

The Bondjet BJ855 is the latest generation of fully automated fine wire bonders and expands the existing product portfolio of fine wire bonders. The Bondjet BJ855 is characterized by the following features:

  • Wedge-Wedge and Ball-Wedge bondheads
  • Optimized pattern recognition (PR)
  • Software features for the growing demand of connectivity & industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, ...)
  • Hesse Assist Tools: load cell, bondtool detection, bond tool calibration without wedge gauge for operator independency

The Bondjet BJ855 meets the increasing demands of bonding and contributes to easy porting through smart functions such as the bondhead memory or the chip libraries. Typical applications are components in RF technology, COB, MCM, hybrids, optical and automotive electronics. In addition to a standard configuration, Hesse offers automation concepts individually adapted for every application. The Bondjet BJ855 defines the latest state of technological development compared to the competition and is benchmarked for:

  • The fastest bonding speed in the industry
  • The largest working area
  • The greatest axis accuracy

Fine Wire Bonder Bondjet BJ653 A Bonder for manual or automatic bonding

The Bondjet BJ653, with its changeable bond heads, serves the wire bonding processes of wedge-wedge as well as ball-wedge and can handle fine wire, heavy wire and ribbon. The operating methods from manual to automatic bonding is particularly appropriate for the use in laboratories, in the development and for suppliers for validating their product quality. BJ653 is ideal for product samples, pre-production prototypes or small volume production runs in proven and reliable Hesse quality. The Bondjet BJ653 is part of the new bonder generation and offers the same handling regarding operation and look & feel as the the fully automatic machines of Hesse. It is characterized by an open workspace, which achieves the same process result as in a fully automated production wire bonder. The Bondjet BJ653 has a lower throughput than the other Bondjets but is the avenue to fully automatic wire bonding. The available bondheads for the BJ653 are identical to the bondheads for the Hesse production machines. This enables a targeted preparation of the production process on the Bondjet BJ653.


Heavy Wire Bonder Bondjet BJ955/BJ959 Fully Automatic Heavy Wire Wedge Bonder

Bondjets BJ955 and BJ959 of the new bonder generation are ultrasonic wedge-wedge bonders developed for the fully automated processing of a wide range of large-sized substrates, chips and other materials. The systems can be used as a fully automatic machine or operated manually. Hesse offers the only available solution on the market of handling wires from 50 µm up to 600 µm** with only one bondhead.

Bondjet BJ955/959 are characterized by several new features:

  • Optimized pattern recognition
  • Software features for the growing demand of connectivity and industry 4.0 (e.g. Hesse Bonder Network, remote control of PR, improved MES integration, ...)
  • Hesse Assist Tools: load cell, bondtool and wire spool detection, tool calibration without wedge gauge for operator independency

Outstanding features are high speed and the largest bonding area. A change from aluminium to copper can be realized within minutes. The Hesse GmbH, as technology leader, has designed the only heavy wire bondhead with a non-destructive pulltest and a unique transducer integrated sensor for 100% quality monitoring in real-time. Advanced features available on the Bondjet BJ955 and BJ959 are designed to meet your present and future requirements and greatly enhance productivity.


Automation

The precise and safe handling of the products in and out of the production machine plays a significant role in controlling the product quality, yield and efficiency of the production equipment. For this reason Hesse GmbH is offering automation concepts individually adapted for every application. The portfolio of automation components for our machines consists of the following groups:

  • Transport system / Indexer

  • Bonding station / manual workholder and heat blocks

  • Magazine lifts

  • Visualization

  • MES interface



Trade Fairs


SMT CONNECT Nuremberg

May 7 - 9, 2019


Productronica Munich

November 12-15, 2019