Vacuum Soldering Systems

 

The main advantages of vacuum soldering at up to 450 ° C are:

  • oxide and void-free bonding surfaces of the chip to the ceramic substrate
  • integrated or separate execution of cleaning and scaling processes
  • little or no residual contamination to the product
  • no outgassing processes on the product
  • different pressure ranges feasible in closed housings
  • closing of housings with a defined gas atmosphere
  • assembly under high vacuum
  • integration of drying and degassing
  • the possibility of further miniaturization
  • the better dissipation of waste heat
  • a considerably increased yield

Want to learn more? Please contact us.


Trade Fairs


SMT CONNECT Nuremberg

May 7 - 9, 2019


Productronica Munich

November 12-15, 2019