Geringer A1

Geringer A2

• Single large area bond station for eutectic processes, epoxy stamping and/or epoxy dispensing (can also be used for glob-top), pick&place dies from wafer, gel-, waffle pack or tape&reel, die placement control with positional and rotational corrections
  
• Flexible die presentation: wafer frames, hoop rings, waffle packs or gel packs,  no restriction on type & mix
  
• Eutectic heater with programmable rapid ramp technology and forced cooling
  
• Walking beam indexer, belt conveyor system, reel to reel system magazine loader / unloader available for fully automatic production

• 2 independent X-Y gantry stations
  - epoxy station: stamping and / or dispensing (can also be used for glob-top),
  - pick&place station: pick&place dies from wafer, gel- or waffle-pack, with positional and rotational die placement corrections
  
• Flexible die presentation: wafer frames, hoop rings, waffle packs or gel packs,
  no restriction on type & mix
  
• Walking beam indexer, belt conveyor system, reel to reel system magazine loader / unloader available for fully automatic production