Home     Feeder - JEDEC Trays     Die Bonder from Geringer     Manufacturers     Events     About us     News     Sitemap       20.06.2013           - - - quicksearch - - - About us AMS Bonding Tools Contact DIAS Die Sorter Events Geringer Die Bonder Hesse Wire and Die Bonder Home INCAL Burn-in Test MARCH Plasma Microelectronics MIDAS Package Repair MIYACHI Sealing NORCOMM Leak Test Organisation PEAK Test Handler PLASTRONICS Sockets PROFOUND Solder Balls Semiconductor industry TTE Lead Frame Magazine WEB Test Handler              Sitemap    Home    Jedec Tray Feeder JTF2 - JTF3 - JTF5 Landscape - WPFx             Contact us worldwide    Die Attach / Flip Chip Bonding with max.Flexibility and Accuracy    Manufacturers             Advanced Micro Solution             Bondtools, Downholders, Rubber Tips etc.             Reliable low cost system for microelectronics manufacturing             Geringer Die Bonder             Wedgebonder and Ultrasonic Flipchip Bonder             Reliability and Burn-in Systems             Quality improvements with plasma             Midas Technology -- Delidding of hermetic sealed packages             Hermetic Sealing of TO and Butterfly             Fine Leak Test with Laser             Flexible Test Handler, Tri Temp, any packages             Burn-in und Testsockel, QFN, BGA, LGA, LCC, 1.27, 1.0, .8, .5, .4             Profound Material Technology PMTC             Magazines, Alu IC Tubes, Boat Carrier, Waffer Cassette             Test Handling of packaged integrated circuits    Exhibitions, demos and meetings    Quasys at a glance             Organisation             How to find Quasys             Open Positions             Contact Form    News    Sitemap    Quasys AG , Allmendstrasse 11 , 6312 Steinhausen , Tel.: +41 41 740 20 60 , Fax: +41 41 741 62 13 , E-Mail   Â© 2006-12 by Quasys AG